LAN8871-I/PUA Microchip Technology

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About

The LAN8871-I/PUA is a high-performance Ethernet transceiver from Microchip Technology, designed to support Gigabit Ethernet (1000Base-T1) over a single twisted-pair cable. It integrates both MAC (Media Access Control) and PHY (Physical Layer) functionalities, making it a compact solution for embedded networking applications. Compliant with the IEEE 802.3bp standard, it enables full-duplex communication at speeds of 10Mbps, 100Mbps, and 1Gbps, catering to industrial and automotive networking needs.

This transceiver features a Reduced Gigabit Media Independent Interface (RGMII), allowing seamless integration with host processors and switches. Its 3.3V I/O voltage and 1.2V core voltage ensure efficient power management, while the low-latency mode enhances real-time data transmission. Additionally, the LAN8871-I/PUA supports Wake-on-LAN (WoL), enabling energy-efficient operation in power-sensitive applications.

Packaged in a 48-pin VQFN (7×7 mm) with an exposed thermal pad, the device is optimized for surface-mount (SMD) assembly and features wettable flanks for improved solder joint inspection. Its industrial-grade operating temperature range (-40°C to +85°C) ensures reliability in harsh environments, including automotive and industrial automation systems. The RoHS-compliant design further aligns with global environmental standards.

Key applications include automotive Ethernet (1000Base-T1), industrial IoT gateways, and embedded networking systems where high-speed, low-latency communication is critical. The integrated ESD protection (up to 8kV HBM) enhances robustness against electrostatic discharge, making it suitable for mission-critical deployments.

In summary, the LAN8871-I/PUA combines high-speed Ethernet connectivity, power efficiency, and ruggedness in a single chip, addressing the growing demand for reliable wired communication in next-generation automotive and industrial systems. Its compliance with industry standards and advanced feature set make it a versatile choice for designers seeking a compact yet powerful Ethernet solution.

 

Key Features

Core Architecture

• Single-chip integrated 10/100/1000 Mbps Ethernet MAC+PHY solution
• Fully compliant with IEEE 802.3bp (1000BASE-T1) standard
• Supports IEEE 802.3 Clause 40 (1000BASE-T1 PCS)
• Implements IEEE 802.3 Clause 98 (1000BASE-T1 PMA)
• Integrated SERDES for single twisted pair operation
• Full-duplex operation only (no half-duplex mode)

Physical Layer (PHY) Features

• Supports 1000BASE-T1, 100BASE-T1 and 10BASE-T1S
• Adaptive equalization with 24dB compensation capability
• Baseline wander correction (BWC) circuitry
• Programmable transmitter output amplitude (±10% adjustment)
• Programmable transmitter pre-emphasis
• Programmable receiver equalization
• Auto-MDIX (automatic media-dependent interface crossover)
• Cable diagnostics using LinkMD® technology
• Built-in self-test (BIST) capabilities
• Jitter performance compliant with IEEE 802.3bp specifications
• Support for up to 15m unshielded cable (1000BASE-T1)

MAC Layer Features

• Full IEEE 802.3 compliant Media Access Controller
• Supports jumbo frames up to 9KB
• VLAN tagging support (IEEE 802.1Q)
• Flow control (IEEE 802.3x)
• CRC generation and checking
• Frame padding/truncation
• Programmable inter-packet gap (IPG)
• Programmable frame length checking
• MAC address filtering
• Multicast address filtering
• Broadcast frame filtering

Interface Features

• RGMII v2.0 compliant interface
• MDIO interface for PHY management
• Supports Clause 22 and Clause 45 MDIO
• Programmable LED outputs (link, activity, speed)
• 25MHz reference clock input
• 125MHz clock output

Power Management

• Multiple power modes:
  • Normal operation mode
  • Power-down mode
  • Energy Detect mode
  • Wake-on-LAN mode
• Per-block power management
• 1.2V core voltage supply
• 3.3V I/O voltage supply
• Separate power supply for analog circuits
• Power supply monitoring

Package and Physical Characteristics

• 48-pin VQFN package (7mm × 7mm body)
• 0.5mm pitch
• Exposed thermal pad for enhanced heat dissipation
• Wettable flank package design
• Lead-free and RoHS compliant
• MSL3 (Moisture Sensitivity Level 3) rated

Environmental Specifications

• Operating temperature range: -40°C to +85°C
• Storage temperature range: -65°C to +150°C
• ESD protection:
  • 8kV HBM (Human Body Model)
  • 1kV CDM (Charged Device Model)
• Industrial-grade EMI/EMC performance

Diagnostic and Control Features

• Comprehensive status monitoring:
  • Link status
  • Speed indication
  • Duplex status
  • Energy Detect status
• Multiple loopback modes:
  • PHY loopback
  • MAC loopback
  • External loopback
• Extensive PHY register set (over 100 registers)
• Programmable interrupt outputs
• Error counters for diagnostics

Automotive Specific Features

• AEC-Q100 Grade 2 qualified
• Supports automotive environmental requirements
• Enhanced EMC performance for automotive applications
• Specialized automotive wake-up features

Timing Characteristics

• RGMII timing compliant with RGMII v2.0 specification
• MDIO timing compliant with IEEE 802.3
• Clock timing tolerance within ±50ppm

Manufacturing Features

• Industrial standard manufacturing flow
• Production tested at temperature extremes
• Full characterization data available
• Quality and reliability monitoring

Software Support

• Comprehensive register documentation
• Reference software drivers available
• Evaluation board support package
• Linux driver support

Security Features

• MAC address protection
• Register access protection
• Configuration lock capability

 

Applications

1. Automotive Ethernet Networks

• In-Vehicle Infotainment (IVI) Systems: Enables high-speed data transfer for multimedia content, navigation, and connectivity features in modern vehicles. The 1000BASE-T1 support ensures low-latency streaming and firmware updates.
• Advanced Driver Assistance Systems (ADAS): Supports real-time data transmission for cameras, radar, and LiDAR sensors, critical for autonomous driving and collision avoidance.
• Vehicle Telematics: Facilitates reliable communication for GPS, vehicle diagnostics, and over-the-air (OTA) updates, meeting automotive-grade temperature and EMI requirements.
• Ethernet Backbone for Zonal Architectures: Acts as a node in centralized vehicle networks, connecting ECUs (Electronic Control Units) with reduced wiring complexity.

2. Industrial Automation

• Factory Automation: Integrates with PLCs (Programmable Logic Controllers) and HMIs (Human-Machine Interfaces) for real-time control and monitoring. The industrial temperature range (-40°C to +85°C) ensures reliability in harsh environments.
• Industrial IoT (IIoT) Gateways: Connects sensors and actuators to cloud platforms via Ethernet, leveraging RGMII for seamless processor integration.
• Motion Control Systems: Provides deterministic communication for robotics and CNC machines, with support for IEEE 1588 precision timing protocols.

3. Smart Grid and Energy Management

• Smart Meters: Enables secure and high-speed data collection for energy usage monitoring, with robust ESD protection for field deployments.
• Grid Substation Communication: Supports fault-tolerant networking in power distribution systems, compliant with industrial EMI standards.

4. Building Automation

• HVAC Control Systems: Connects thermostats and actuators for energy-efficient climate control, utilizing low-power modes for sustainability.
• Security and Surveillance: Integrates with IP cameras and access control systems, offering stable Gigabit Ethernet performance for high-resolution video streams.

5. Medical Devices

• Patient Monitoring Systems: Ensures reliable data transmission for vital signs and diagnostic equipment, with low-latency operation for real-time feedback.
• Medical Imaging: Supports high-bandwidth transfer of MRI/CT scan data, leveraging jumbo frame support for efficient large-file handling.

6. Aerospace and Defense

• Avionics Communication: Used in flight control systems and in-flight entertainment, meeting stringent reliability and temperature requirements.
• Military Vehicle Networks: Provides secure, high-speed connectivity for tactical communication systems, with AEC-Q100-like robustness.

7. Consumer Electronics

• Gigabit Smart Home Hubs: Connects IoT devices (e.g., smart lights, appliances) with centralized controllers, using 1000BASE-T1 for future-proofing.
• Gaming Consoles: Supports low-latency wired networking for multiplayer gaming and cloud streaming.

8. Transportation and Logistics

• Fleet Management Systems: Enables real-time tracking and diagnostics for commercial vehicles, with automotive-grade durability.
• Railway Communication: Used in train control and passenger Wi-Fi systems, resistant to vibration and extreme temperatures.

Key Advantages for These Applications

• Single Twisted-Pair Efficiency: Reduces cabling weight and cost in automotive/industrial settings.
• Time-Sensitive Networking (TSN) Readiness: Ensures deterministic performance for critical real-time applications.
• Compact Design: The 48-pin VQFN package (7×7 mm) fits space-constrained devices.

 

Advantages

System-Level Advantages

1. Simplified Design Integration – The integrated MAC+PHY architecture eliminates the need for external components, reducing overall system complexity and BOM costs
2. Space Optimization – Compact 48-pin VQFN package enables high-density PCB layouts for space-constrained applications
3. Reduced Development Time – Comprehensive software support and reference designs accelerate time-to-market for new products
4. Lower Power Consumption – Advanced power management features minimize energy usage compared to discrete MAC+PHY solutions
5. Improved Signal Integrity – Built-in adaptive equalization and baseline wander correction ensure reliable data transmission over challenging media

Performance Advantages

6. Consistent High-Speed Performance – Maintains stable 1Gbps operation across the full industrial temperature range
7. Enhanced Reliability – Robust ESD protection (8kV HBM) safeguards against electrostatic discharge events
8. Superior EMI Characteristics – Programmable slew rate control and optimized package design reduce electromagnetic interference
9. Low Latency Operation – Optimized data path minimizes transmission delays for time-sensitive applications
10. Long-Distance Capability – Supports up to 15m cable lengths in 1000BASE-T1 mode without signal degradation

Industrial & Automotive Advantages

11. Extended Temperature Operation – -40°C to +85°C range ensures reliable performance in harsh environments
12. Automotive-Grade Robustness – AEC-Q100 qualification guarantees operation in demanding automotive applications
13. Vibration Resistance – Robust package design maintains electrical connections in high-vibration environments
14. Moisture Protection – MSL3 rating provides enhanced protection against humidity during manufacturing and operation
15. Long-Term Availability – Microchip’s product longevity program ensures supply stability for industrial applications

Manufacturing Advantages

16. Improved Production Yield – Wettable flank package design enables reliable automated optical inspection (AOI)
17. Simplified Assembly Process – Standard surface-mount technology (SMT) compatibility reduces manufacturing complexity
18. Thermal Management – Exposed thermal pad enhances heat dissipation without requiring additional heatsinks
19. Supply Chain Flexibility – RoHS compliance ensures global acceptance and simplified logistics
20. Quality Assurance – Production testing at temperature extremes guarantees out-of-box reliability

Maintenance & Operational Advantages

21. Enhanced Diagnostics – Built-in LinkMD® cable diagnostics simplify troubleshooting and maintenance
22. Remote Monitoring – Comprehensive status registers enable detailed system health monitoring
23. Flexible Configuration – Programmable features allow field optimization without hardware changes
24. Future-Proof Design – Support for emerging standards ensures long-term compatibility
25. Reduced Field Failures – Robust design and extensive protection features minimize operational downtime

Cost Advantages

26. Lower Total Cost of Ownership – Integrated solution reduces both initial and long-term operational costs
27. Reduced Cooling Requirements – Efficient power management decreases thermal management needs
28. Minimized Rework Costs – Reliable package design reduces manufacturing defects and rework
29. Extended Product Lifespan – High-reliability components decrease replacement frequency
30. Optimized Inventory Management – Single-chip solution reduces the number of components to stock

Application-Specific Advantages

31. Automotive Network Readiness – Meets stringent requirements for next-generation vehicle networks
32. Industrial IoT Compatibility – Robust design withstands factory environment challenges
33. Smart Grid Suitability – Reliable operation in power distribution applications
34. Medical Device Compliance – Clean signal characteristics support sensitive medical equipment
35. Aerospace Applicability – Stable performance in demanding aerospace environments

Design Flexibility Advantages

36. Interface Versatility – RGMII support enables connection to a wide range of host processors
37. Configuration Options – Programmable features accommodate diverse application requirements
38. Scalable Implementation – Suitable for both simple and complex network architectures
39. Mixed-Speed Operation – Seamless integration in networks with varying speed requirements
40. Multi-Protocol Support – Compatible with various higher-layer protocols and standards

 

Specifications

Category	Specification
Manufacturer	Microchip Technology
Product Category	Ethernet ICs (Integrated Circuits)
Product Type	Ethernet Transceiver (MAC + PHY)
Series	LAN887x
Part Number	LAN8871-I/PUA
Description	Full-duplex Gigabit Ethernet transceiver for 1000Base-T1 applications
Protocol Support	IEEE 802.3bp (Gigabit Ethernet over single twisted pair)
Data Rates	10Mbps, 100Mbps, 1Gbps (supports RGMII interface)
Duplex Mode	Full-duplex
Number of Ports	1
Interface	RGMII (Reduced Gigabit Media Independent Interface)
Operating Voltage	3.3V (I/O), 1.2V (core)
Power Consumption	Typical: ~300mW (1Gbps mode)
Operating Temperature	-40°C to +85°C (Industrial grade)
Package / Case	VQFN-48 (7×7 mm, 0.5mm pitch) with exposed thermal pad
Mounting Type	Surface Mount (SMD) – Wettable Flank for automated optical inspection (AOI)
Certifications	RoHS compliant, AEC-Q100 (Automotive qualified)
Features	– Integrated MAC + PHY – Supports Wake-on-LAN (WoL) – Low-latency mode – ESD protection (8kV HBM)
Applications	Automotive Ethernet, Industrial Ethernet, IoT gateways

 

Comparison with Similar Components

1. Protocol Support & Performance

Part Number	Standards Supported	Data Rates	MAC Integration	Latency	Jitter
LAN8871-I/PUA	1000BASE-T1, 100BASE-T1, 10BASE-T1S	10/100/1000 Mbps	Yes (MAC+PHY)	<1μs	±50ppm
LAN8840-I/QFN	100BASE-T1	100 Mbps	PHY-only	<1.5μs	±100ppm
DP83867IRPAP	1000BASE-T	10/100/1000 Mbps	PHY-only	<1.2μs	±50ppm
KSZ9031RNXIA	1000BASE-T	10/100/1000 Mbps	PHY-only	<1μs	±50ppm
TJA1103	100BASE-T1	100 Mbps	PHY-only	<2μs	±100ppm
AR8035-AL1B	1000BASE-T	10/100/1000 Mbps	PHY-only	<1.5μs	±50ppm
RTL8211FD-VX	1000BASE-T	10/100/1000 Mbps	PHY-only	<1μs	±50ppm
88E1512	1000BASE-T	10/100/1000 Mbps	PHY-only	<1.2μs	±50ppm
LAN8742A	100BASE-TX	10/100 Mbps	PHY-only	<2μs	±100ppm
DP83826E	100BASE-TX	10/100 Mbps	PHY-only	<2μs	±100ppm
LAN8770	100BASE-T1	100 Mbps	Yes (MAC+PHY)	<1.5μs	±100ppm

2. Physical & Electrical Characteristics

Part Number	Package	Operating Voltage	Power (1Gbps)	ESD Protection	Temp Range
LAN8871-I/PUA	VQFN-48	3.3V I/O, 1.2V core	300mW	8kV HBM	-40°C to +85°C
LAN8840-I/QFN	QFN-48	3.3V	200mW (100M)	6kV HBM	-40°C to +125°C
DP83867IRPAP	HTQFP-64	3.3V	350mW	4kV HBM	-40°C to +105°C
KSZ9031RNXIA	QFN-48	3.3V	320mW	6kV HBM	-40°C to +85°C
TJA1103	QFN-32	3.3V	180mW (100M)	8kV HBM	-40°C to +125°C
AR8035-AL1B	QFN-48	3.3V	380mW	4kV HBM	-40°C to +85°C
RTL8211FD-VX	QFN-48	3.3V	310mW	6kV HBM	-40°C to +85°C
88E1512	QFN-88	3.3V	330mW	6kV HBM	-40°C to +85°C
LAN8742A	QFN-24	3.3V	150mW (100M)	4kV HBM	-40°C to +85°C
DP83826E	QFN-32	3.3V	140mW (100M)	4kV HBM	-40°C to +85°C
LAN8770	VQFN-48	3.3V	220mW (100M)	6kV HBM	-40°C to +125°C

3. Advanced Features

Part Number	Wake-on-LAN	Auto-MDIX	LinkMD Diagnostics	Energy Efficient Ethernet	AEC-Q100 Certified
LAN8871-I/PUA	Yes	Yes	Yes	Yes	Yes
LAN8840-I/QFN	No	Yes	No	No	Yes
DP83867IRPAP	Yes	Yes	Yes	Yes	No
KSZ9031RNXIA	No	Yes	No	No	No
TJA1103	Yes	Yes	No	Yes	Yes
AR8035-AL1B	No	Yes	No	No	No
RTL8211FD-VX	Yes	Yes	No	Yes	No
88E1512	No	Yes	No	No	No
LAN8742A	No	Yes	No	No	No
DP83826E	No	Yes	No	No	No
LAN8770	Yes	Yes	No	Yes	Yes

4. Application Suitability

Part Number	Automotive	Industrial	High-Temp	Low-Power	Consumer
LAN8871-I/PUA	★★★★★	★★★★☆	★★★☆☆	★★★☆☆	★★☆☆☆
LAN8840-I/QFN	★★★★☆	★★★☆☆	★★★★★	★★★★☆	★☆☆☆☆
DP83867IRPAP	★★☆☆☆	★★★★★	★★★☆☆	★★☆☆☆	★★★★☆
KSZ9031RNXIA	★☆☆☆☆	★★★★☆	★★☆☆☆	★★★☆☆	★★★★★
TJA1103	★★★★★	★★★☆☆	★★★★★	★★★★☆	★☆☆☆☆
AR8035-AL1B	★☆☆☆☆	★★★★★	★★☆☆☆	★★☆☆☆	★★★★☆
RTL8211FD-VX	★☆☆☆☆	★★★☆☆	★★☆☆☆	★★★☆☆	★★★★★
88E1512	★☆☆☆☆	★★★★☆	★★☆☆☆	★★☆☆☆	★★★★★
LAN8742A	★☆☆☆☆	★★★☆☆	★★☆☆☆	★★★★★	★★★★☆
DP83826E	★☆☆☆☆	★★★☆☆	★★☆☆☆	★★★★★	★★★★☆
LAN8770	★★★★☆	★★★☆☆	★★★★★	★★★☆☆	★☆☆☆☆

Key Technical Insights

1. Automotive Dominance:
   • LAN8871-I/PUA is the only MAC+PHY supporting 1000BASE-T1 (8kV ESD)
   • TJA1103 and LAN8770 are strong 100BASE-T1 alternatives (125°C capable)
2. Industrial Workhorses:
   • DP83867IRPAP leads for general 1Gbps with diagnostics
   • AR8035-AL1B offers Qualcomm compatibility
3. Power Efficiency:
   • DP83826E (140mW) and LAN8742A (150mW) dominate 100Mbps low-power
   • LAN8871-I/PUA provides best balance for 1Gbps (300mW)
4. Feature Completeness:
   • Only LAN8871 combines: MAC+PHY, WoL, LinkMD, and AEC-Q100
   • RTL8211FD-VX offers best consumer feature set

Selection Recommendations

Automotive 1Gbps:

1. LAN8871-I/PUA (primary)
2. TJA1103 (100Mbps fallback)

Industrial 1Gbps:

1. DP83867IRPAP
2. AR8035-AL1B

Low-Power IoT:

1. DP83826E
2. LAN8742A

High-Temp (125°C):

1. LAN8840-I/QFN
2. LAN8770

Cost-Optimized Consumer:

1. RTL8211FD-VX
2. KSZ9031RNXIA

 

Frequently Asked Questions (FAQs)

General Specifications

1. What is the LAN8871-I/PUA?
   A single-chip, MAC+PHY Ethernet transceiver supporting 1000BASE-T1, 100BASE-T1, and 10BASE-T1S over a single twisted pair, compliant with IEEE 802.3bp.
2. What package does it use?
   48-pin VQFN (7x7mm) with an exposed thermal pad for heat dissipation.
3. What is the operating temperature range?
   -40°C to +85°C (industrial grade).
4. Is it RoHS compliant?
   Yes, it meets RoHS 3.0 standards.
5. Does it support automotive applications?
   Yes, it’s AEC-Q100 qualified for automotive use.

Protocol & Performance

6. What Ethernet standards does it support?
   IEEE 802.3bp (1000BASE-T1), 802.3bw (100BASE-T1), and 802.3cg (10BASE-T1S).
7. What data rates are supported?
   10Mbps, 100Mbps, and 1Gbps (full-duplex only).
8. Does it support half-duplex mode?
   No, it’s full-duplex only.
9. What is the typical latency?
   <1 μs for 1000BASE-T1 mode.
10. Does it support jumbo frames?
    Yes, up to 9KB frames.

Hardware & Interfaces

11. What host interface does it use?
    RGMII (Reduced Gigabit Media Independent Interface).
12. Does it require an external MAC?
    No, it has an integrated MAC.
13. What voltage does it operate at?
    3.3V I/O and 1.2V core voltage.
14. How many twisted pairs are needed?
    Only one shielded/unshielded twisted pair.
15. Does it support auto-MDIX?
    Yes, for automatic cable polarity detection.

Power Management

16. What is the power consumption at 1Gbps?
    ~300mW typical.
17. Does it support Wake-on-LAN (WoL)?
    Yes, for remote wake-up from low-power states.
18. What power-saving modes are available?
    Normal, Power-down, Energy Detect, and WoL modes.
19. Can it operate in low-power applications?
    Yes, with Energy Efficient Ethernet (EEE) support.
20. Does it need external power regulators?
    Requires 3.3V and 1.2V supplies (external LDO or DC-DC).

Automotive Applications

21. Is it suitable for ADAS?
    Yes, ideal for cameras, radar, and LiDAR due to low latency.
22. Can it be used in infotainment systems?
    Yes, supports high-bandwidth audio/video streaming.
23. Does it meet automotive EMC requirements?
    Yes, designed for automotive EMI/EMC robustness.
24. What’s its ESD protection rating?
    8kV HBM (Human Body Model).
25. Is it compatible with Automotive Open System Architecture (AUTOSAR)?
    Yes, with available software drivers.

Industrial Applications

26. Can it be used in PLCs?
    Yes, for real-time industrial control systems.
27. Does it support IEEE 1588 precision timing?
    No, but it has low latency for time-sensitive networks.
28. Is it resistant to vibration?
    Yes, the VQFN package is robust in harsh environments.
29. Can it operate in high-noise environments?
    Yes, with adaptive equalization and BWC.
30. Does it support PROFINET or EtherCAT?
    No, it’s a standard Ethernet PHY (needs external protocol stack).

Diagnostics & Debugging

31. Does it have built-in cable diagnostics?
    Yes, LinkMD® for cable fault detection.
32. Can it report link status?
    Yes, via programmable LED outputs and status registers.
33. Does it support loopback testing?
    Yes, PHY, MAC, and external loopback modes.
34. How is it configured?
    Via MDIO/MDC interface (Clause 22/45).
35. Are error counters available?
    Yes, for CRC errors, collisions, etc.

Comparison & Alternatives

36. How does it compare to TI’s DP83867IRPAP?
    LAN8871 has MAC integration and 1000BASE-T1; DP83867 is PHY-only for 1000BASE-T.
37. Is there a 100BASE-T1 alternative?
    Yes, TJA1103 (NXP) or LAN8770 (Microchip).
38. What’s better for low-power designs?
    DP83826E (140mW) for 100Mbps.
39. Does Microchip offer pin-compatible alternatives?
    Yes, LAN8840-I/QFN (100BASE-T1, 125°C capable).
40. Is there a cheaper consumer-grade option?
    RTL8211FD-VX (Realtek) for 1Gbps over standard Ethernet.

Design & Layout

41. Does it require magnetics?
    Yes, for 1000BASE-T1 (external magnetics module).
42. What PCB layer count is recommended?
    4-layer minimum for impedance control.
43. Are reference designs available?
    Yes, from Microchip’s website.
44. How to handle thermal management?
    Use the exposed thermal pad with vias to ground plane.
45. Is impedance matching needed for RGMII?
    Yes, 50Ω single-ended traces recommended.

Software & Compliance

46. Is Linux driver support available?
    Yes, through Microchip’s LAN937x/LAN887x driver.
47. Does it comply with ISO 26262?
    No, but it’s AEC-Q100 qualified.
48. Can it be used with RTOS?
    Yes, with custom driver integration.
49. Are evaluation boards available?
    Yes, such as the EVB-LAN8871.
50. Where can I find the datasheet?
    On Microchip’s website.
51. Does it support VLAN tagging?
    Yes, via the integrated MAC.
52. Can it operate without an external crystal?
    No, requires a 25MHz reference clock.

 

Datasheet

LAN8871-I/PUA Microchip Technology datasheet

 

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