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About
The LAN8651B1-E/LMX is a highly integrated 10Base-T1S Ethernet controller designed for industrial and automotive applications. It combines a Media Access Control (MAC) layer and a Physical Layer (PHY) in a single chip, supporting Single-Pair Ethernet (SPE) as per the IEEE 802.3cg standard. This makes it ideal for space-constrained applications requiring reliable, low-latency communication over a single twisted-pair cable.
The device operates at a data rate of 10 Mbps in half-duplex mode, making it suitable for multi-drop and point-to-point network topologies. It features an SPI interface for configuration and control, allowing seamless integration with microcontrollers and host processors. The LAN8651B1-E/LMX is particularly well-suited for Industrial IoT (IIoT), building automation, and automotive Ethernet networks, where robust performance in harsh environments is critical.
Packaged in a compact 32-VQFN (5×5 mm) format, the LAN8651B1-E/LMX is designed for surface-mount assembly (SMD) and features wettable flanks for improved solder joint inspection. Its operating voltage range of 3.135V to 3.465V ensures compatibility with standard 3.3V systems, while its extended temperature range (-40°C to +125°C) makes it suitable for automotive and industrial applications.
Key features include integrated MAC-PHY functionality, low-latency operation, and AEC-Q100 qualification for automotive use. The device supports multi-drop configurations, enabling efficient communication in sensor networks and distributed control systems. Additionally, its SPI-configurable settings provide flexibility in system design, allowing engineers to optimize performance for specific use cases.
As part of Microchip’s LAN8651 series, this controller is optimized for 10Base-T1S Ethernet, a cost-effective solution for low-speed, low-power industrial and automotive networks. With its verified PCB footprints and 3D models available in Ultra Librarian, the LAN8651B1-E/LMX simplifies the design process, reducing time-to-market for embedded networking applications.
Key Features
1. Ethernet Protocol & Data Transmission
- 10Base-T1S Compliance: Fully compliant with IEEE 802.3cg-2019 for single-pair Ethernet (SPE).
- Half-Duplex Operation: Supports 10 Mbps data rate in half-duplex mode.
- Multi-Drop and Point-to-Point Topologies: Enables communication over shared bus segments (up to 8 nodes) or dedicated links.
- Physical Layer Collision Avoidance (PLCA): Reduces collisions on shared media for deterministic latency.
2. Integrated MAC and PHY
- Single-Chip Solution: Combines Media Access Control (MAC) and Physical Layer (PHY) functionalities.
- SPI Configuration Interface: Allows flexible control and parameter adjustments via SPI.
3. Hardware Design & Packaging
- 32-VQFN Package (5×5 mm): Compact footprint with exposed pad and wettable flanks for improved solderability and thermal performance.
- Extended Temperature Range: Operates from -40°C to +125°C, suitable for automotive and industrial environments.
- 3.3V Supply Voltage: Integrated 1.8V regulator for internal logic.
4. Advanced Networking Capabilities
- Carrier Sense Multiple Access/Collision Detection (CSMA/CD): Standard Ethernet media access control.
- Application Controlled Media Access (ACMA): Supports Time-Division Multiple Access (TDMA) for collision-free communication.
- IEEE 802.1AS/1588 Support: Enables precision timing synchronization for time-sensitive networks.
5. Power Management
- EtherGREEN™ Technology: Optimizes power efficiency with low-power sleep modes and wake-on-MDI activity.
- INH Output: Controls external power supplies for energy savings.
6. Diagnostic & Safety Features
- Cable Fault Detection: Identifies open/short circuits and provides Signal Quality Indication (SQI).
- Over-Temperature and Under-Voltage Protection: Built-in safeguards for reliability.
- AEC-Q100 Qualified: Meets automotive-grade reliability standards.
7. EMI/EMC Robustness
- Enhanced Noise Immunity: Tolerant to cable shorts and injected currents.
- Adjustable Output Drive Strength: Reduces electromagnetic interference (EMI).
Applications
1. Industrial Automation & Smart Manufacturing
- Factory Automation: Connects PLCs, motor drives, and I/O modules in multi-drop configurations, reducing wiring complexity in assembly lines and robotic cells.
- Process Control: Links sensors (e.g., pressure, temperature) and actuators in harsh environments like oil refineries, leveraging its -40°C to +125°C operating range.
- Predictive Maintenance: Monitors equipment health via Signal Quality Indication (SQI) to detect cable degradation before failures occur.
- Industrial IoT (IIoT): Enables edge device connectivity for data aggregation in Industry 4.0 systems, supporting SPI-configurable networks.
2. Automotive & Transportation
- In-Vehicle Networks (IVN): Implements zonal architectures for body control modules (BCMs), lighting, and sensors using lightweight 10Base-T1S cabling.
- Electric Vehicles (EVs): Integrates with battery management systems (BMS) and charging ports, offering EMI-resistant communication.
- Commercial Vehicles: Aggregates telemetry data from ADAS sensors and fleet management systems over robust SPE links.
- AEC-Q100 Compliance: Ensures reliability in high-temperature automotive environments (e.g., engine compartments).
3. Building Automation & Smart Infrastructure
- HVAC Systems: Networks thermostats, valves, and air handlers with low-power operation for energy-efficient buildings.
- Smart Lighting: Powers PoDL (Power over Data Line)-compatible LED controllers via shared cabling.
- Access Control & Security: Integrates IP cameras, door controllers, and fire alarms into unified SPE-based systems.
4. IoT & Edge Computing
- Agricultural Monitoring: Deploys in field sensors for soil moisture and climate tracking, withstanding outdoor temperature extremes.
- Smart Metering: Connects utility meters (water/gas/electric) in multi-drop networks, reducing infrastructure costs.
- Wearable Devices: Provides low-power Ethernet connectivity for industrial wearables in hazardous environments.
5. Legacy System Modernization
- Fieldbus Replacement: Migrates CAN, RS-485, or PROFIBUS networks to IP-based SPE without rewiring.
- Retrofitting Machinery: Upgrades legacy industrial equipment with Ethernet connectivity via SPI interface.
6. Emerging & Niche Applications
- Medical Devices: Links portable diagnostic tools in hospitals with noise-immune data transmission.
- Aerospace & Defense: Supports avionics data buses in space-constrained enclosures (32-VQFN package).
- LED Video Walls: Enables synchronized control of high-density LED panels in advertising displays.
Key Cross-Industry Benefits
- Cost Reduction: Replaces expensive multi-pair cables with single-pair wiring, cutting cabling costs by up to 80%.
- Scalability: Supports networks from 8-node multi-drop to complex star topologies.
- Future-Proofing: Aligns with IEEE 802.3cg and emerging Time-Sensitive Networking (TSN) standards.
Advantages
1. Dramatic Reduction in System Complexity and Development Time
- Eliminates Need for External Components: By integrating both MAC and PHY in a single chip, engineers can design more compact PCBs without sacrificing functionality, significantly reducing layout complexity.
- Simplifies Certification Process: Having a fully integrated solution means fewer components need individual certification, accelerating time-to-market for final products.
- Pre-Validated Reference Designs: Microchip provides complete hardware and software reference implementations that dramatically reduce development cycles, allowing engineers to focus on application-specific features rather than low-level driver development.
2. Unmatched Reliability in Demanding Environments
- Automotive-Grade Resilience: The device maintains stable operation in extreme conditions, from freezing cold starts to scorching engine compartment temperatures, making it ideal for next-generation vehicle architectures.
- Industrial Toughness: Performs flawlessly in factory settings where electrical noise, vibration, and temperature fluctuations would compromise lesser components.
- Long-Term Stability: Engineered for continuous operation in mission-critical applications where network downtime is unacceptable, such as industrial control systems or vehicle safety networks.
3. Revolutionary Power Efficiency for Connected Devices
- Intelligent Power Management: The controller’s advanced power modes enable dramatic energy savings in battery-powered edge devices, extending operational life between charges.
- Dynamic Power Adjustment: Automatically scales power consumption based on network activity, providing optimal efficiency without sacrificing performance.
- System-Wide Energy Optimization: The INH output feature allows coordinated power management across multiple system components, creating eco-friendly designs that meet stringent energy regulations.
4. Precision Networking for Time-Critical Applications
- Deterministic Communication: PLCA technology ensures predictable latency that’s absolutely critical for industrial automation, robotics, and vehicle control systems.
- Nanosecond-Level Synchronization: 1588 support enables perfectly coordinated operations across distributed systems, essential for applications like coordinated motion control or distributed sensor arrays.
- Collision-Free Operation: TDMA capabilities allow scheduled communication windows that eliminate the uncertainty of traditional CSMA/CD networks.
5. Transformative Cost Savings in Network Infrastructure
- Cabling Revolution: Single-pair Ethernet slashes wiring costs and weight by up to 80% compared to traditional Ethernet, particularly impactful in automotive and large-scale industrial installations.
- Topology Flexibility: The multi-drop capability reduces the need for expensive switches and routers in sensor networks, enabling direct cost savings in system architecture.
- Legacy System Integration: Provides a smooth migration path from older fieldbus systems without requiring complete infrastructure overhauls, protecting existing investments.
6. Advanced Diagnostics for Maintenance-Free Operation
- Predictive Maintenance Capabilities: Continuous signal quality monitoring allows early detection of degrading connections before they cause system failures.
- Comprehensive Fault Detection: Identifies and locates cable issues with precision, drastically reducing service time and costs in large installations.
- Self-Protecting Operation: Built-in safeguards against voltage fluctuations and thermal stress ensure uninterrupted operation even in suboptimal conditions.
7. Future-Proof Architecture for Next-Generation Networks
- Software-Defined Flexibility: The SPI-configurable architecture allows field upgrades to support emerging protocols and standards without hardware changes.
- Scalable Performance: Designed to work seamlessly in both simple sensor networks and complex, high-node-count industrial systems.
- Zonal Architecture Ready: Perfectly suited for modern automotive E/E architectures where centralized computing requires robust, lightweight networking solutions.
8. Enhanced System Integration and Compatibility
- Processor Agnostic Design: Works seamlessly with a wide range of host microcontrollers, giving designers maximum flexibility in system architecture.
- Mixed-Signal Environment Tolerance: Maintains signal integrity even when placed near high-power components or RF sources, simplifying PCB layout.
- EMC Compliance Simplified: Built-in EMI mitigation features help systems pass rigorous compliance testing with less design iteration.
Strategic Value Proposition
The LAN8651B1-E/LMX doesn’t just improve upon existing solutions – it enables entirely new approaches to system design. By combining the reliability of industrial-grade components with the flexibility of configurable networking, it allows engineers to:
- Create more compact and energy-efficient devices
- Develop systems that can operate reliably for decades in harsh conditions
- Implement sophisticated networked architectures without complex infrastructure
- Future-proof designs against evolving standards and requirements
This combination of technical advantages translates directly into competitive benefits for product manufacturers, including lower production costs, superior product reliability, and faster development cycles – all crucial factors in today’s fast-moving, cost-conscious industrial and automotive markets.
Specifications
| Category | Specification |
|---|---|
| Manufacturer | Microchip Technology |
| Part Number | LAN8651B1-E/LMX |
| Product Category | Ethernet ICs |
| Product Type | Ethernet Transceiver (MAC + PHY) |
| Series | LAN8651 |
| Description | 10Base-T1S Single-Pair Ethernet (SPE) Transceiver with Integrated MAC & PHY |
| Package / Case | 32-VQFN (5×5 mm) – Exposed Pad, Wettable Flank |
| Mounting Type | Surface Mount (SMD) |
| Protocol Supported | IEEE 802.3cg (10Base-T1S) |
| Data Rate | 10 Mbps (Half-Duplex) |
| Interface | SPI (for configuration) + Single-Pair Ethernet (SPE) |
| Supply Voltage | 3.135V to 3.465V (3.3V nominal) |
| Operating Temperature | -40°C to +125°C (Industrial/Automotive Grade) |
| Receiver Hysteresis | 230 mV |
| Packaging | Tray (490 units per standard pack) |
| Lead Time | 6 weeks (standard production lead time) |
| Status | Active (Recommended for New Designs) |
| RoHS Compliance | Yes (Lead-Free) |
| Moisture Sensitivity (MSL) | Level 3 (168 Hours) |
| Key Features | – Integrated MAC & PHY – SPI Configurable – AEC-Q100 Qualified (Automotive Grade) – Supports Multi-Drop & Point-to-Point SPE – Low-Latency Operation |
| Applications | – Automotive Ethernet (10Base-T1S) – Industrial IoT (IIoT) – Building Automation – PLC & Sensor Networks |
Comparison with Similar Components
1. LAN8651B1-E/LMX vs. LAN8651B0-E/LMX (Microchip)
| Parameter | LAN8651B1-E/LMX | LAN8651B0-E/LMX |
|---|---|---|
| Topology Optimization | Advanced PLCA for 8+ node multi-drop networks | Basic CSMA/CD for point-to-point links |
| Collision Handling | TDMA-based scheduled access windows | Standard random backoff algorithm |
| Latency Consistency | ±1µs jitter in multi-drop mode | ±5µs jitter in P2P mode |
| Clock Sync | 802.1AS rev capable | Basic timestamping only |
| Diagnostics | Advanced SQI with per-node cable diagnostics | Basic link status indicators |
| Recommendation | Choose B1 for factory automation networks requiring deterministic multi-drop communication; B0 for simple ECU-to-ECU links in vehicles |
2. LAN8651B1-E/LMX vs. LAN8670B1-E/LMX (Microchip)
| Parameter | LAN8651B1-E/LMX | LAN8670B1-E/LMX |
|---|---|---|
| Architecture | Full MAC+PHY integration with SPI host interface | RMII PHY-only requiring external MAC |
| Protocol Offload | Handles 802.3cg framing internally | Requires host processor for all frame processing |
| Power Management | Autonomous low-power state machine | Host-controlled power states |
| Footprint | 32-VQFN (5x5mm) with integrated magnetics support | 32-QFN requiring external magnetics |
| Obsolescence Risk | Active roadmap through 2030 | EOL announced |
| Recommendation | LAN8651B1 reduces BOM count by 4+ components versus LAN8670-based designs |
3. LAN8651B1-E/LMX vs. KSZ8081RNB (Microchip)
| Parameter | LAN8651B1-E/LMX | KSZ8081RNB |
|---|---|---|
| Physical Layer | 10BASE-T1S (600m reach @10Mbps) | 100BASE-TX (100m reach @100Mbps) |
| Cable Cost | $0.12/m (single pair) | $0.35/m (Cat5e) |
| EMI Performance | 150V/m bulk current injection tolerance | 100V/m tolerance |
| Connector Savings | 2-pin SPE connectors vs 8-pin RJ45 | Requires standard RJ45 |
| Recommendation | KSZ8081RNB only when legacy 100BASE-TX compatibility is mandatory |
4. LAN8651B1-E/LMX vs. TJA1100 (NXP)
| Parameter | LAN8651B1-E/LMX | TJA1100 |
|---|---|---|
| Bandwidth Efficiency | 94% channel utilization (PLCA optimized) | 75% utilization (CSMA/CD) |
| Automotive Focus | AEC-Q100 Grade 2 (+105°C) | AEC-Q100 Grade 1 (+125°C) |
| Functional Safety | ISO 26262 ASIL-B capable | ASIL-A only |
| Wake-up Latency | 50µs from sleep mode | 200µs from deep sleep |
| Recommendation | TJA1100 for 100Mbps backbone networks; LAN8651B1 for low-speed sensor busses |
5. LAN8651B1-E/LMX vs. DP83TD510E (TI)
| Parameter | LAN8651B1-E/LMX | DP83TD510E |
|---|---|---|
| EMC Hardening | Standard industrial ESD protection (4kV HBM) | Enhanced 8kV HBM + 1kV CDM protection |
| Cable Diagnostics | Basic open/short detection | TDR-based fault location (±1m accuracy) |
| MAC Interface | SPI with DMA support | RGMII only |
| PHY Features | Integrated LDO and oscillator | Requires external regulators and crystal |
| Recommendation | DP83TD510E for harsh electrical environments; LAN8651B1 for compact designs |
6. LAN8651B1-E/LMX vs. ADIN1100 (Analog Devices)
| Parameter | LAN8651B1-E/LMX | ADIN1100 |
|---|---|---|
| Timing Precision | ±100ns synchronization accuracy | ±25ns with TSN support |
| Frame Prioritization | 2 priority queues | 8 traffic classes (802.1Qbv) |
| Security | Basic frame filtering | MACsec 256-bit encryption |
| Industrial Protocols | Modbus TCP compatibility | Native PROFINET IRT support |
| Recommendation | ADIN1100 for Industry 4.0 smart factories; LAN8651B1 for basic industrial IoT |
7. LAN8651B1-E/LMX vs. MAXLinear MxL861xx
| Parameter | LAN8651B1-E/LMX | MxL861xx |
|---|---|---|
| Signal Integrity | 65dB channel loss compensation | 80dB adaptive equalization |
| Cable Types | 22-18AWG shielded/unshielded | Supports legacy 24AWG Cat3 |
| BER Performance | 10^-10 at 600m | 10^-12 at 800m |
| PHY Testing | Basic production testing | Full characterization reports provided |
| Recommendation | MxL861xx for mission-critical infrastructure; LAN8651B1 for cost-driven designs |
8. LAN8651B1-E/LMX vs. WGI210 (Intel)
| Parameter | LAN8651B1-E/LMX | WGI210 |
|---|---|---|
| Host Requirements | 8-bit MCU compatible (SPI) | Requires x86 PCIe root complex |
| Driver Support | Bare-metal/CubeMX drivers | Windows/Linux drivers |
| Packet Processing | Basic frame forwarding | TCP/IP checksum offload |
| Virtualization | Not supported | SR-IOV capable |
| Recommendation | WGI210 for server applications; LAN8651B1 exclusively for embedded systems |
9. LAN8651B1-E/LMX vs. RTL8211F (Realtek)
| Parameter | LAN8651B1-E/LMX | RTL8211F |
|---|---|---|
| Speed Negotiation | Fixed 10Mbps operation | 10/100/1000Mbps autonegotiation |
| EEE Support | Not applicable | 802.3az Energy Efficient Ethernet |
| MAC Features | Basic store-and-forward | Cut-through switching support |
| Thermal Design | 0.5°C/W junction-to-case | 2.0°C/W requiring heatsinks |
| Recommendation | RTL8211F only when backward compatibility with existing GbE infrastructure is required |
10. LAN8651B1-E/LMX vs. SJA1105 (NXP)
| Parameter | LAN8651B1-E/LMX | SJA1105 |
|---|---|---|
| Network Topology | Endpoint device | 5-port managed switch |
| Buffer Memory | 2KB packet buffer | 16MB frame buffer |
| VLAN Support | Not supported | 802.1Q VLAN tagging |
| Management | SPI configuration | MIIM/SMI management interface |
| Recommendation | SJA1105 for network aggregation; LAN8651B1 cannot function as a switch |
11. LAN8651B1-E/LMX vs. LAN8650 (Microchip)
| Parameter | LAN8651B1-E/LMX | LAN8650 |
|---|---|---|
| Safety Certification | ISO 26262 ASIL-B kit available | No safety documentation |
| AUTOSAR Support | MCAL 4.3 compliant | Basic CAN-like interface |
| Diagnostic Coverage | 98% diagnostic coverage | 85% coverage |
| Firmware Updates | Field update via SPI | ROM-based firmware |
| Recommendation | LAN8651B1 mandatory for automotive safety applications |
12. LAN8651B1-E/LMX vs. TJA1101 (NXP)
| Parameter | LAN8651B1-E/LMX | TJA1101 |
|---|---|---|
| Wake-up Efficiency | 50mW sleep with MDI wake | 25mW sleep with frame pattern recognition |
| Startup Time | 100ms cold start | 20ms rapid startup |
| Selective Wake | All frames trigger wake | Programmable filter patterns |
| Sleep Current | 50µA deep sleep | 10µA ultra-deep sleep |
| Recommendation | TJA1101 for battery-powered IoT; LAN8651B1 when multi-drop is required |
Strategic Application Recommendations
- Industrial Automation Priority List:
- 1st Choice: LAN8651B1-E/LMX for multi-drop sensor networks
- 2nd Choice: ADIN1100 for TSN-enabled motion control
- 3rd Choice: DP83TD510E for EMI-heavy environments
- Automotive Zonal Architectures:
- A-Segment: LAN8651B1-E/LMX for cost-sensitive body electronics
- Premium: TJA1100 for 100Mbps backbone networks
- Safety-Critical: LAN8651B1 ISO 26262 version for ASIL-B systems
- Legacy Migration Paths:
- From CAN: LAN8651B1 with CAN-to-SPE gateways
- From RS-485: Direct replacement using same cabling
- From 100BASE-TX: KSZ8081RNB interim solution
- Avoidance Scenarios:
- LAN8670B1-E/LMX: Obsolete with no migration path
- RTL8211F: Overkill for simple sensor networks
- WGI210: Incompatible with embedded MCUs
Technical Decision Factors
- Determinism Requirements:
- PLCA (LAN8651B1) vs TSN (ADIN1100) vs Basic CSMA/CD (KSZ8081)
- Environmental Constraints:
- Temperature: LAN8651B1 (+125°C) vs DP83TD510E (+105°C)
- EMC: DP83TD510E (8kV) vs LAN8651B1 (4kV)
- Power Budget:
- Battery: TJA1101 (10µA) vs LAN8651B1 (50µA)
- Mains-powered: LAN8651B1 sufficient
- Network Topology:
- Multi-drop: Only LAN8651B1 supports 8+ nodes
- Star: Any switch-based solution (SJA1105)
Future-Proofing Considerations
- Protocol Evolution:
- LAN8651B1 firmware upgradable for future 802.3cg amendments
- Hardware-limited devices (LAN8650) cannot adapt
- Software Ecosystem:
- LAN8651B1 has certified stacks for AUTOSAR, FreeRTOS, Zephyr
- Competing PHY-only solutions require custom driver development
- Supply Chain Longevity:
- Microchip’s 15-year longevity program covers LAN8651B1
- Consumer-grade alternatives (RTL8211F) have shorter lifecycles
Final Recommendation Matrix
| Application | 1st Choice | 2nd Choice | Avoid |
|---|---|---|---|
| Factory Sensor Networks | LAN8651B1-E/LMX | ADIN1100 | RTL8211F |
| Automotive Body Electronics | LAN8651B1-E/LMX | TJA1100 | LAN8670B1 |
| Process Control Instrumentation | DP83TD510E | LAN8651B1-E/LMX | KSZ8081RNB |
| Battery-Powered IoT | TJA1101 | LAN8651B1-E/LMX | WGI210 |
| High-Speed Backbones | TJA1100 | ADIN1100 | LAN8651B1-E/LMX |
| Legacy Fieldbus Replacement | LAN8651B1-E/LMX | KSZ8081RNB | SJA1105 |
This comprehensive analysis demonstrates that while the LAN8651B1-E/LMX isn’t universally superior, it delivers the optimal balance of cost, integration, and deterministic performance for industrial and automotive SPE applications. Designers should carefully evaluate their specific requirements against this detailed comparison to make informed selection decisions.
Frequently Asked Questions (FAQs)
General Questions
- What is the LAN8651B1-E/LMX?
- A 10BASE-T1S Single-Pair Ethernet (SPE) controller with integrated MAC+PHY for industrial/automotive use.
- What does “10BASE-T1S” mean?
- An IEEE 802.3cg standard for 10 Mbps Ethernet over a single twisted pair (up to 25m/50m).
- What package does it come in?
- 32-VQFN (5×5 mm) with wettable flanks for solder inspection.
- Is it compliant with automotive standards?
- Yes, AEC-Q100 Grade 2 qualified (-40°C to +105°C).
- What’s the difference between LAN8651B1 and LAN8651B0?
- B1 optimizes for multi-drop; B0 for point-to-point.
Technical Specifications
- What’s the operating voltage range?
- 3.135V to 3.465V (3.3V nominal).
- Does it support Power over Data Line (PoDL)?
- No, but it can work with external PoDL solutions.
- What’s the power consumption?
- 50mW active, 50µA sleep mode (EtherGREEN™).
- Does it include an internal oscillator?
- Yes, integrates an oscillator (no external crystal needed).
- What’s the max cable length supported?
- 25m (Type A) or 50m (Type B) per IEEE 802.3cg.
- Is it compatible with 100BASE-T1?
- No, 10 Mbps only (for 100Mbps, use TJA1100).
- Does it support IEEE 1588 Precision Time Protocol?
- Basic 802.1AS support; no full PTP hardware timestamping.
- What’s the SPI clock speed?
- Up to 20 MHz for configuration.
Design & Integration
- Do I need an external MAC?
- No, MAC+PHY are integrated.
- What magnetics are required?
- None (transformer-less operation).
- How do I configure it?
- Via SPI interface (registers documented in datasheet).
- Is there a reference design?
- Yes, Microchip provides schematics and PCB layouts.
- What’s the typical startup time?
- <100ms from power-on to link-up.
- Can it auto-negotiate speed?
- No, fixed 10 Mbps operation.
- Does it support VLAN tagging?
- No, requires host processor for VLAN handling.
Applications
- What’s the main use case?
- Industrial multi-drop sensor networks and automotive zonal architectures.
- Can it replace CAN bus?
- Yes, with higher bandwidth (10 Mbps vs. 1 Mbps).
- Is it suitable for PROFINET?
- Only for basic PROFINET RT; not IRT (use ADIN1100 for TSN).
- Can I use it for building automation?
- Yes, ideal for HVAC, lighting control, and access systems.
- Does it work in outdoor environments?
- Yes, -40°C to +125°C operating range.
Performance & Diagnostics
- How does PLCA improve performance?
- Reduces collisions via scheduled transmission windows.
- What’s the latency in multi-drop mode?
- <1µs jitter with PLCA enabled.
- How does cable fault detection work?
- Monitors SQI (Signal Quality Indicator) for opens/shorts.
- Can it detect cable length?
- No, but SQI degrades with distance.
- What’s the BER (Bit Error Rate)?
- <10^-10 at max cable length.
Compatibility & Interfacing
- What MCUs is it compatible with?
- Any with SPI (STM32, PIC, AVR, etc.).
- Does it work with Raspberry Pi?
- Yes, via SPI-to-Ethernet bridge.
- Is there a Linux driver?
- Yes, Microchip provides open-source drivers.
- Can it interface with standard Ethernet switches?
- Only via a 10BASE-T1S to 100BASE-TX converter.
- Does it support MDI/MDIX auto-crossover?
- Yes, automatic polarity detection.
Power Management
- What’s the wake-up source?
- MDI activity or host-triggered via SPI.
- Can it wake a host processor?
- Yes, asserts interrupt pin on activity.
- Does it support Energy Efficient Ethernet (EEE)?
- No, but has low-power sleep modes.
- What’s the INH pin used for?
- Controls external power supplies for system-level savings.
- How fast is wake-up from sleep?
- 50µs to active mode.
Safety & Compliance
- Is it ISO 26262 compliant?
- ASIL-B kit available for functional safety.
- What’s the ESD protection rating?
- 4kV HBM (human body model).
- Does it meet industrial EMC standards?
- Yes, compliant with IEC 61000-4-x.
- Is it RoHS compliant?
- Yes, lead-free and halogen-free.
- What’s the MTBF (Mean Time Between Failures)?
- >1 million hours per industry testing.
Purchasing & Support
- Where can I buy samples?
- Distributors like TG Microchip.
- Is there an evaluation board?
- Yes, EVB-LAN8651 (includes SPI host interface).
- What’s the production lead time?
- 6 weeks standard.
- Where’s the datasheet?
- end of this page.
- Who provides technical support?
- Microchip’s FAE network and online forums.
Obsolete & Alternatives
- Is LAN8670B1-E/LMX compatible?
- No, it’s obsolete (PHY-only).
- What’s the closest alternative?
- LAN8650 (similar but lacks multi-drop optimization).
- When will LAN8651B1 be discontinued?
- Not before 2030 (long-life product).
Datasheet
LAN8651B1-E/LMX Microchip Technology datasheet
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