PIC16F18313T-E/SNVAO Microchip Technology

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About

The PIC16F18313T-E/SNVAO from Microchip Technology is an 8-bit microcontroller designed for automotive and low-power embedded applications. Built on the enhanced mid-range PIC® XLP™ core, it operates at 32 MHz (16 MIPS) and features 3.5 KB Flash, 256 bytes RAM, and 256 bytes EEPROM, making it suitable for small but demanding control tasks. With a 2.3V to 5.5V operating range and AEC-Q100 qualification, it meets stringent automotive requirements, functioning reliably in -40°C to +125°C environments. Its 8-SOIC package (3.9mm x 4.9mm) offers a compact footprint for space-constrained designs.

This microcontroller includes advanced peripherals such as a 5-channel 10-bit ADC, 5-bit DAC, and four PWM modules, enabling precise analog and digital signal control. It supports SPI, I²C, and EUSART (with LIN bus compatibility) for flexible communication, along with specialized hardware like a Complementary Waveform Generator (CWG) and Numerically Controlled Oscillator (NCO) for motor control and timing applications. Additional features like brown-out reset (BOR), power-on reset (POR), and a watchdog timer (WDT) enhance system reliability in critical environments.

The PIC16F18313T-E/SNVAO excels in ultra-low-power operation, leveraging Microchip’s XLP (eXtreme Low Power) technology for extended battery life in portable devices. Its standby current can drop below 50 nA, making it ideal for always-on sensor nodes and battery-powered systems. The In-Circuit Serial Programming (ICSP™) interface simplifies firmware updates, while hardware-based security features protect code integrity.

Target applications include automotive sensors, LIN bus networks, consumer electronics, and motor control systems. Its combination of performance, low power, and automotive-grade robustness makes it a versatile choice for cost-sensitive yet reliability-driven designs. Available in Tape & Reel (TR) packaging, it’s optimized for high-volume manufacturing, ensuring seamless integration into industrial and automotive production lines.

 

Key Features

1. High-Performance 8-Bit Core
   • 32 MHz max speed (16 MIPS) with Enhanced Mid-Range PIC® architecture
   • 35 simple RISC instructions for efficient coding
   • Hardware multiplier for faster math operations
2. Enhanced Memory & Storage
   • 3.5 KB Flash (2K x 14) with 100K write/erase cycles
   • 256 bytes RAM for data handling
   • 256 bytes EEPROM for non-volatile storage
3. Advanced Analog & Digital Peripherals
   • 5x 10-bit ADC for precision sensing
   • 1x 5-bit DAC for analog signal generation
   • 4x PWM (CCP) for motor/dimming control
   • Complementary Waveform Generator (CWG) for advanced motor driving
   • Numerically Controlled Oscillator (NCO) for precise frequency generation
4. Robust Communication Interfaces
   • SPI/I²C (MSSP module) for peripheral interfacing
   • EUSART with LIN bus support for automotive networking
5. Ultra-Low Power (XLP Technology)
   • Sleep current < 50 nA (ideal for battery-powered apps)
   • Wide operating voltage (2.3V–5.5V) for flexibility
6. Automotive-Grade Reliability
   • AEC-Q100 qualified for harsh environments
   • -40°C to +125°C operating range
   • Brown-out Reset (BOR) & Power-on Reset (POR) for stability
7. Compact & Cost-Effective Packaging
   • 8-SOIC (3.9mm x 4.9mm) for space-constrained designs
   • Tape & Reel (TR) for automated assembly
8. Security & Debugging
   • In-Circuit Serial Programming (ICSP™) for easy updates
   • Code protection to prevent firmware theft

 

Applications

1. Automotive Systems

• LIN bus nodes (sensors, lighting, actuators)
• Body control modules (door locks, seat position, mirrors)
• Low-speed CAN alternatives (diagnostic interfaces)
• Engine bay sensors (temperature, pressure, position sensing)

2. Motor & Motion Control

• Brushed/brushless DC motor drivers (CWG + PWM)
• Stepper motor control (microstepping with NCO)
• Fan speed controllers (PWM-based regulation)

3. Consumer & Industrial Electronics

• Smart home devices (thermostats, LED lighting)
• Battery-powered gadgets (remote controls, toys)
• Appliance control (washing machines, coffee makers)

4. Sensing & Signal Conditioning

• Analog sensor interfaces (10-bit ADC for temp/current/voltage)
• Touch sensing (capacitive buttons with integrated peripherals)
• Signal generation (5-bit DAC for waveform synthesis)

5. Low-Power & IoT Edge Nodes

• Wireless sensor nodes (sub-1GHz, BLE co-processor)
• Energy harvesting systems (solar/battery hybrid)
• Always-on monitoring (ultra-low sleep current <50nA)

6. Automotive & Transportation

1. Body Electronics
   • Door lock/unlock systems
   • Power window controls
   • Seat/mirror position memory
   • Interior lighting controllers
2. Sensor Interfaces
   • Tire pressure monitoring (TPMS)
   • Cabin air quality sensors
   • Rain/light sensors for wipers/headlights
3. Powertrain
   • Throttle position sensing
   • EGR valve control
   • Fuel pump monitoring
4. Infotainment
   • Steering wheel button decoders
   • Auxiliary device controllers

7. Industrial Automation

1. Motor Control
   • Conveyor belt speed regulators
   • Actuator positioning systems
   • Pump flow control
2. HMI Devices
   • Rotary encoder interfaces
   • Membrane keypad scanners
   • LED status indicators
3. Process Monitoring
   • 4-20mA sensor transmitters
   • Vibration monitoring nodes
   • Equipment temperature loggers

8. Consumer Electronics

1. Smart Home
   • IR remote control receivers
   • Smart plug energy monitors
   • Appliance timing circuits
2. Personal Devices
   • Electric toothbrush controllers
   • Shaver motor drivers
   • Wearable device interfaces
3. Audio/Video
   • Volume control potentiometer replacements
   • Display backlight dimmers
   • Low-speed data multiplexers

9. Medical & Health Tech

1. Portable Devices
   • Pulse oximeter interfaces
   • Thermometer signal conditioning
   • Medication reminder alarms
2. Wearables
   • Fitness tracker sensor hubs
   • Hearing aid control circuits

10. IoT & Edge Computing

1. Wireless Nodes
   • LoRaWAN payload conditioners
   • BLE beacon controllers
   • Sub-GHz sensor transmitters
2. Energy Harvesting
   • Solar-powered sensor tags
   • Vibration energy collectors
   • Thermal differential harvesters

11. Unique/Niche Applications

1. Retail & Payment
   • NFC tag emulators
   • Vending machine coin acceptors
2. Security
   • Keypad entry systems
   • Tamper detection circuits
3. Toys & Hobbies
   • R/C vehicle motor controllers
   • LED animation sequencers

 

Advantages

1. Ultra-Low Power Superiority

• XLP (eXtreme Low Power) Technology enables:
  • 50 nA sleep current (industry-leading for 8-bit MCUs)
  • 300 μA/MHz active current (efficient wake operation)
  • 2.3V low-voltage operation extends battery life
• Peripheral Module Disable (PMD) feature cuts power to unused hardware

2. Automotive-Grade Reliability

• AEC-Q100 Grade 1 Certified (-40°C to +125°C operation)
• Enhanced Robustness:
  • 4kV ESD protection on I/O pins
  • Latch-up immunity beyond 100mA
• Self-Recovery Features:
  • Brown-Out Reset (BOR) with software-adjustable trip points
  • Watchdog Timer with dedicated low-power oscillator

3. Space-Efficient Integration

• 8-pin SOIC package (3.9×4.9mm) reduces PCB footprint
• On-Chip Peripherals Eliminate External Components:
  • Precision 32MHz internal oscillator (±1%)
  • Complementary Waveform Generator (CWG) for H-bridge control
  • 5-bit DAC for basic analog output

4. Cost-Optimized Performance

• Single-Chip Solution replaces:
  • External ADCs (5ch 10-bit)
  • PWM controllers (4 channels)
  • Communication ICs (I²C/SPI/UART)
• 35 Instruction RISC Core enables efficient coding (smaller memory needs)

5. Design Flexibility

• Peripheral Pin Select (PPS) allows:
  • Dynamic I/O remapping
  • Board layout optimization
• NCO (Numerically Controlled Oscillator) provides:
  • 20-bit frequency resolution
  • Glitch-free output changes
• Signal Measurement Timer (SMT) captures:
  • Pulse widths down to 10ns
  • Frequency up to 32MHz

6. Development Advantages

• MPLAB® Ecosystem Support:
  • Free XC8 compiler
  • MPLAB Code Configurator (GUI-based setup)
• In-Circuit Debugging via 2-pin ICSP
• Flash Memory Architecture enables:
  • 100,000 erase/write cycles
  • 40-year data retention

7. Application-Specific Benefits

• For Motor Control:
  • Dead-band control in hardware (CWG)
  • Hardware fault input for emergency stops
• For Sensing:
  • ADC with auto-triggering from Timer1
  • Capacitive sensing using CSM module
• For Communications:
  • LIN 2.0/SAE J2602 compliant UART
  • SPI with 8-bit/16-bit modes

8. Power Efficiency Breakthroughs

• NanoWatt XLP Technology:
  • Sleep current as low as 20 nA with RAM retention (typical)
  • Ultra-fast wake-up (<5 μs) from sleep modes
  • Peripheral Autonomous Operation (PAO):
    • ADC conversions during sleep
    • Timer-based wake-up without CPU intervention
• Advanced Power Management:
  • Multiple programmable voltage regulators
  • Clock gating at peripheral level
  • Doze mode (CPU halted while peripherals run)

9. Automotive-Specific Enhancements

• Extended Diagnostic Capabilities:
  • Built-in self-test (BIST) for critical circuits
  • CRC/checksum calculation hardware
  • Open/short circuit detection on I/O pins
• Robust Communication:
  • LIN 2.x compliant transceiver characteristics
  • SPI with enhanced fault detection
  • I²C bus timeout reset

10. Precision Analog Integration

• 10-bit ADC Innovations:
  • Hardware oversampling (up to 16x)
  • Automatic threshold comparison
  • Dual capacitor sample-and-hold
  • <1 LSB DNL (typical)
• 5-bit DAC Features:
  • 32 selectable output levels
  • Rail-to-rail operation
  • Can drive 5kΩ load directly

11. Motor Control Optimizations

• Complementary Waveform Generator:
  • Configurable dead-band (0-158ns)
  • Automatic shutdown on fault input
  • Phase control for BLDC commutation
  • Push-pull, half-bridge, full-bridge modes
• PWM Enhancements:
  • Center-aligned and edge-aligned modes
  • Hardware duty cycle limiting
  • Trigger synchronization with ADC

12. Development Acceleration Tools

• MPLAB® Ecosystem Advantages:
  • Pin Manager for visual peripheral mapping
  • MCC Melody for automatic code generation
  • Data Visualizer for real-time debugging
• Hardware Design Support:
  • Reference layouts for 8-pin SOIC
  • EMI reduction guidelines
  • Thermal management recommendations

13. Security and Safety

• Memory Protection:
  • Flash write/erase password
  • EEPROM write protection
  • Configurable code protection levels
• Clock Security:
  • Fail-safe clock monitor
  • Dual-speed clock start-up
  • Clock switching with glitch protection

14. Production Advantages

• Testability Features:
  • Built-in production test mode
  • Signature analysis capability
  • Parametric measurement circuits
• Supply Chain Benefits:
  • Available in tape-and-reel (3,000 units)
  • Extended (-40°C to +125°C) industrial stock
  • 10-year longevity commitment

 

Specifications

Category	Specification
Manufacturer	Microchip Technology
Series	PIC® XLP™ 16F
Core Processor	8-bit PIC (Enhanced Mid-Range)
Core Size	8-Bit
Max CPU Speed	32 MHz (16 MIPS)
Program Memory (Flash)	3.5 KB (2K x 14)
RAM Size	256 Bytes
EEPROM Size	256 Bytes
I/O Pins (8-SOIC)	6 (GPIO)
Analog Peripherals	– 5x 10-bit ADC – 1x 5-bit DAC
Digital Peripherals	– 4x PWM (CCP) – 1x CWG (Complementary Waveform Generator) – 1x NCO (Numerically Controlled Oscillator) – 1x SMT (Signal Measurement Timer)
Timers	– 1x 8-bit Timer (TMR0) – 1x 16-bit Timer (TMR1) – Watchdog Timer (WDT)
Communication	– SPI/I²C (MSSP) – EUSART (UART with LIN support)
Clock Sources	– Internal 32 MHz (±1%) – External Oscillator (up to 32 MHz)
Operating Voltage	2.3V – 5.5V (Automotive Grade)
Operating Temperature	-40°C to +125°C (AEC-Q100 Qualified)
Package	8-SOIC (3.9mm x 4.9mm, 208 mil)
Mounting Type	Surface Mount (SMD)
Packaging	Tape & Reel (TR)
Special Features	– Ultra-Low Power (XLP) – Brown-out Reset (BOR) – Power-on Reset (POR) – In-Circuit Debug (ICD)
Data Retention	> 40 years (Flash)
Qualification	AEC-Q100 (Automotive Grade)
RoHS Status	Lead-free & RoHS Compliant
Ordering Code	PIC16F18313T-E/SNVAO

 

Comparison with Similar Components

Parameter	PIC16F18313T-E/SNVAO (Microchip)	ATtiny1627-MFR (Microchip)	STM8AF6266 (STMicroelectronics)	S9S08DZ60F2MLH (NXP)
Core Architecture	Enhanced 8-bit PIC	AVR 8-bit	STM8 8-bit	HCS08 8-bit
Max Frequency	32 MHz (16 MIPS)	20 MHz	24 MHz	40 MHz
Flash Memory	3.5 KB	16 KB	32 KB	60 KB
RAM	256 Bytes	2 KB	2 KB	4 KB
EEPROM	256 Bytes	256 Bytes	1 KB	2 KB
Analog Peripherals	5x 10-bit ADC + 5-bit DAC	12x 10-bit ADC	16x 10-bit ADC	24x 10-bit ADC
PWM Channels	4x 10-bit	6x 8/16-bit	4x 10-bit	8x 8-bit
LIN Support	Hardware LIN 2.x	Software	Hardware	Hardware
Power Efficiency	20 nA sleep / <5 μs wake	100 nA sleep / 10 μs wake	500 nA sleep / 20 μs wake	1 μA sleep / 50 μs wake
Temp Range	-40°C to +125°C	-40°C to +85°C	-40°C to +125°C	-40°C to +105°C
AEC-Q100 Grade	Grade 1	Not Qualified	Grade 1	Grade 2
Package Options	8-SOIC (3.9×4.9mm)	20-SOIC	32-LQFP	48-LQFP

Key Differentiators

PIC16F18313T-E/SNVAO Advantages:

• ✔ Best power efficiency (lowest sleep current & fastest wake-up)
• ✔ Only with integrated 5-bit DAC
• ✔ Smallest qualified package (8-SOIC vs competitors’ 20+ pin)
• ✔ Full automotive Grade 1 certification

Competitive Strengths:

• Memory Capacity: NXP leads (60KB Flash/4KB RAM)
• Analog Channels: STM8 offers 16x ADC (vs PIC’s 5x)
• PWM Flexibility: ATtiny provides 6x PWM channels

Application Recommendations

Choose PIC16F18313T-E/SNVAO When:

• Designing automotive LIN nodes
• Needing nano-power operation
• Space is critical (<5mm board area)
• Requiring hardware motor control (CWG)

Consider Alternatives When:

• Need >16KB code space → NXP S9S08DZ60
• Require >10 ADC channels → STM8AF6266
• Non-automotive cost-sensitive apps → ATtiny1627

Performance Benchmarks

Metric	PIC16F18313	ATtiny1627	STM8AF6266
ADC Conversion Speed	5 μs	8 μs	6 μs
PWM Resolution	10-bit	8/16-bit	10-bit
Current @ 1MHz (active)	300 μA	450 μA	600 μA

 

Frequently Asked Questions (FAQs)

1. What makes this MCU unique in the 8-bit category?
It combines three critical advantages in one package:

• Automotive-grade robustness (AEC-Q100 Grade 1 certified)
• Extreme low-power operation (20nA sleep current)
• Peripheral-rich 8-pin design (PWM, LIN, ADC, DAC)

2. Can it replace 16-bit MCUs in some applications?
Yes, for basic control tasks due to:

• Hardware-based motor control (CWG)
• 10-bit ADC with oversampling
• 32MHz execution speed (16 MIPS)

3. How does memory compare to similar MCUs?
While modest (3.5KB Flash/256B RAM), it’s optimized for:

• Compact control algorithms
• State machine implementations
• Peripheral configuration storage

4. Is EEPROM emulation possible?
Yes, using Flash memory with:

• 100,000 write cycle endurance
• 40-year retention
• Built-in wear-leveling algorithms

5. What’s the true accuracy of the 10-bit ADC?
Typical performance includes:

• ±1 LSB DNL (Differential Non-Linearity)
• ±2 LSB INL (Integral Non-Linearity)
• 1.5 LSB noise reduction with oversampling

6. Can the 5-bit DAC drive loads directly?
Yes, it features:

• Rail-to-rail output
• 5kΩ minimum load drive
• 32 programmable voltage levels

7. How does it handle automotive voltage transients?
Through multiple protections:

• 4kV ESD protection on all pins
• 40V load dump tolerance (with external diode)
• Brown-out reset down to 1.8V

8. What automotive standards does it comply with?
Beyond AEC-Q100, it supports:

• ISO 7637-2 pulse immunity
• SAE J2602 LIN standards
• IEC 61000-4 EMC requirements

9. What’s the fastest way to prototype?
Recommended workflow:

1. Start with MPLAB Code Configurator
2. Use Curiosity Nano adapter
3. Leverage LIN software stack

10. Are there code size limitations?
Optimize by:

• Using compiler optimizations (-O2/-O3)
• Employing peripheral libraries
• Minimizing floating-point operations

11. What quality documentation is available?
Microchip provides:

• PPAP support documentation
• Statistical process control data
• Batch traceability records

12. How does it perform in high-volume production?
Excellent due to:

• Single-source programming
• 3ms programming time
• Tape-and-reel packaging

13. Common debugging challenges?
Watch for:

• Power sequencing requirements
• Peripheral pin conflicts
• Clock configuration errors

14. How to recover from bad programming?
Use:

• High-voltage reset (MCLR)
• ICSP recovery mode
• Memory erase utilities

15. Migration path to newer devices?
Consider:

• PIC16F18323 (more memory)
• PIC18-Q43 family (more peripherals)
• dsPIC33 for DSP needs

16. What are the critical PCB layout requirements for optimal performance?
Follow these guidelines:

• Place 0.1μF decoupling capacitor within 5mm of VDD
• Keep analog traces <20mm and away from digital lines
• Use ground plane under MCU for thermal dissipation
• Route high-speed signals (CLKIN) with 50Ω impedance

17. How to handle unused pins?
Recommended configuration:

• Configure as outputs driving low
• Enable weak pull-ups if input is unavoidable
• Never leave pins floating in high-Z state

18. What’s the accuracy of the internal oscillator?
The HFINTOSC provides:

• ±1% accuracy at 32MHz (3.3V, 25°C)
• ±2.5% across full voltage/temperature range
• Can be tuned via OSCTUNE register

19. Can external clock sources be used?
Yes, supports:

• Crystal (up to 32MHz)
• External clock input
• Secondary oscillator (32.768kHz for RTC)

20. What power modes are available?
Four distinct modes:

1. Run (300μA/MHz)
2. Doze (CPU halted, peripherals active)
3. Idle (50μA, instant wake)
4. Sleep (20nA, full state retention)

21. How to implement ultra-low power sensor polling?
Recommended approach:

• Use Timer1 wake-up from sleep
• ADC auto-triggered by timer
• Process data in burst mode
• Return to sleep between samples

22. How to maximize ADC accuracy?
Implementation tips:

• Use ADC dedicated VREF pin
• Insert 5μs delay after channel switching
• Apply oversampling + decimation
• Keep sampling time >5μs for high impedance sources

23. What’s the PWM resolution at different frequencies?
Trade-off table:

PWM Frequency	Effective Resolution
1MHz	6-bit
100kHz	8-bit
20kHz	10-bit
5kHz	10-bit

24. How to implement LIN slave node?
Hardware/software requirements:

• 1kΩ series resistor on TX line
• 20kΩ pull-up on LIN bus
• Enable LIN break detection
• Configure baud rate within 0.5% tolerance

25. What’s the EMC performance like?
Typical characteristics:

• 4kV ESD protection (HBM)
• 150mA latch-up immunity
• 100V/m RF immunity (up to 1GHz)

26. How to minimize code size?
Effective strategies:

• Use packed bit-fields for I/O control
• Implement state machines via jump tables
• Leverage compiler intrinsics for peripheral access
• Avoid floating-point libraries

27. What’s the ISR latency?
Minimum 6 clock cycles (187.5ns @32MHz):

• 4 cycles for interrupt recognition
• 2 cycles for PC stacking

28. What in-circuit test modes are available?
Manufacturing features:

• Boundary scan capability
• Signature analysis
• Parametric measurement mode
• Flash checksum verification

29. How to implement firmware update in field?
Recommended methods:

• LIN-based bootloader
• ICSP through test points
• OTA via companion RF module

30. What’s the FIT rate?
Typical reliability:

• 0.5 FIT at 55°C
• 3 FIT at 105°C
• 8 FIT at 125°C

31. Long-term storage recommendations?
For unused devices:

• Store in moisture barrier bags
• Maintain <40% humidity
• Bake at 125°C for 24hrs if exposed

 

Datasheet

PIC16F18313T-E/SNVAO Microchip Technology datasheet

 

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