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Table of Contents ( Quick Access )
Features
- Serial Interface Architecture- Nibble-wide multiplexed I/O’s with SPI-like serial command structure: Mode 0 and Mode 3
- x1/x2/x4 Serial Peripheral Interface (SPI) Protocol and SQI protocol
- Burst Modes- Continuous linear burst, 8/16/32/64 Byte linear burst with wrap-around
- Page-Program- 256 Bytes per page in x1 or x4 mode
- Flexible Erase Capability- Uniform 4 KByte sectors, Four 8 KByte top and bottom parameter overlay blocks, One 32 KByte top and bottom overlay block, Uniform 64 KByte overlay blocks
- Software Write Protection- Individual Block-Locking: 64 KByte blocks, two 32 KByte blocks, and eight 8 KByte parameter blocks
- Low Power Consumption: Active Read current: 15 mA (typical @ 104 MHz), Standby Current: 15 µA (typical)
- Serial Flash Discoverable Parameters (SFDP)
- Industrial -40ºC to +85ºC and Extended -40ºC to +105ºC
- Packages Available: 8-contact WDFN (6mm x 5mm), 8-lead SOIC (208 mil), 16-lead SOIC (300 mil), 24-ball TBGA (6mm x 8mm)
- All devices are RoHS compliant
- Automotive Grade 2 and 3 available
Parametrics
Battery Backup | False |
Bus Modes | SPI,SDI,SQI |
Data Retention (Years) | 100 |
Density (Organization) | 64 Mbit |
Endurance | 100,000 |
Max. Clock Freq. | 104 MHz |
Oper Voltage Max (V) | 3.6 |
Operating Voltage Min. (V) | 2.3 |
Page Size (bytes) | 256 |
Write Protect Scheme | Software Configurable |
Write Protected | False |
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